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Offering up to 51.2 Tbps throughput, a8ÓéÀÖ¡¯s 7060X6 series delivers the highest density of 800G switching in a single chip platform optimized for AI leaf and spine clusters. Deterministic, low latency, line rate performance, proven layer 2 and layer 3 features powered by a8ÓéÀÖ EOS, advanced traffic awareness, and instrumentation provide the ideal foundation for ultra-high performance applications with scale to match our largest customers¡¯ cluster requirements. The a8ÓéÀÖ 7060X6 series also provides richer than ever support for telemetry, smart load balancing and congestion control mechanisms that are essential for today¡¯s growing AI and ML networks.

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The 7060X6 series delivers a rich choice of port speeds and density including support for 50GbE, 100GbE, 200GbE, 400GbE and 800G, enabling consistent network architectures that seamlessly scale from small dedicated clusters to the needs of the largest multi-tier networks.

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The following tables provide an overview of all a8ÓéÀÖ 7060X6 Series models grouped by interface type.

7060X6-64PE	7060X6-32PE
800G 2RU system High Density 800G ports with OSFP800 for flexible 800G, 400G, 200G, 100G, 50G and 10G support Maximum of 64 ports of 800G or 128 ports of 400G 51.2 Tbps of wire speed performance with 165 MB of buffers Optimized for AI back end and DC applications	800G 1RU system High Density 800G ports with OSFP800 for flexible 800G, 400G, 200G, 100G, 50G and 10G support Maximum of 32 ports of 800G or 64 ports of 400G 25.6 Tbps of wire speed performance with 84 MB of buffers Optimized for AI back end and DC applications